CMP Process Engineer: Advanced Packaging Focus

Same platform, different brand. Your saved jobs and alerts as well as your log in details have moved with you. Adecco is partnering with a premier supplier of high-quality Flip Chip Ball Grid Array (FC-BGA) substrates in search of CMP Process Engineer to join their organization. The Job: Process Development & Optimization Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric, etc.) in advanced substrate manufacturing. Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness. Equipment & Tooling Support Define equipment specifications and validate CMP tools. Monitor and maintain CMP tool performance, including pad conditioning, slurry delivery systems, and endpoint detection technologies. Yield & Quality Improvement Investigate and resolve CMP-related defects (e.g., dishing, erosion, scratching, delamination). Implement process monitoring techniques like thickn...