Job Description
Job Responsibilities
Process Development & Optimization
Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric, etc.) in advanced substrate manufacturing. Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness. Equipment & Tooling Support
Define equipment specifications and validate CMP tools. Monitor and maintain CMP tool performance, including pad conditioning, slurry delivery systems, and endpoint detection technologies. Yield & Quality Improvement
Investigate and resolve CMP-related defects (e.g., dishing, erosion, scratching, delamination). Implement process monitoring techniques like thickness metrology (e.g., ellipsometry, profilometry) and defect inspection. Process Integration
Collaborate with upstream and downstream process owners (e.g., plating, lithography, etching) to ensure seamless integration. Support the development of process ...
Process Development & Optimization
Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric, etc.) in advanced substrate manufacturing. Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness. Equipment & Tooling Support
Define equipment specifications and validate CMP tools. Monitor and maintain CMP tool performance, including pad conditioning, slurry delivery systems, and endpoint detection technologies. Yield & Quality Improvement
Investigate and resolve CMP-related defects (e.g., dishing, erosion, scratching, delamination). Implement process monitoring techniques like thickness metrology (e.g., ellipsometry, profilometry) and defect inspection. Process Integration
Collaborate with upstream and downstream process owners (e.g., plating, lithography, etching) to ensure seamless integration. Support the development of process ...
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