Job Description
Purpose of the Job
- To support R&D activities for 2.5D wafer-level packaging (WLP) processes—including Die Preparation, Chip Attach, and Mold—focusing on process reliability, manufacturability, and integration for advanced semiconductor packages.
- Develop and optimize key 2.5D CoW (Chip-on-Wafer) processes: Die Preparation: grinding, laser grooving, dicing saw
Chip Attach: TCB (Thermo-Compression Bonding), LCB (Laser Compression Bonding)
Mold: compression or transfer mold for warpage and protection - Perform material evaluation and reliability analysis (e.g., XRF, shear test)
- Conduct DOE/FMEA for robust process design and improvement
- Work closely with cross-functional teams (e.g., Bumping, RDL, Failure Analysis) to enable seamless process integration
- Track and analyze industry trends in equipment, materials, and technologies
- Support new product introduction (NPI) ...
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