Job Description
Walk-In Drive: IC Package Design Engineer (3+ Years)
Weekend Hiring Drive – HCLTech | Bangalore (Jigani Campus)
HCLTech is hiring skilled professionals for the role of IC Package Design Engineer. If you have a passion for advanced package and PCB design, we invite you to attend our walk-in drive!
Interview Details
- Date: 16 May 2026 (Saturday)
- Time: 9:00 AM – 2:00 PM
- Venue: Tower 4, GF café 3 , HCLTech, Jigani Campus, Bangalore
- Mode: Face-to-Face (F2F)
- SPOC: Mareeswari C M
Role: IC Package Design Engineer
Experience: 3+ Years
Key Responsibilities & Required Skills
- Strong experience in IC Package / Substrate Design (mandatory)
- Hands-on experience with Cadence APD (Allegro Package Designer)
- Good understanding of package/substrate design and assembly rules, especially for flip chip designs
- Exposure to various package technologies such as MCM, Flip-Chip, Wire Bond, 2.5D, 3D (added ...
Weekend Hiring Drive – HCLTech | Bangalore (Jigani Campus)
HCLTech is hiring skilled professionals for the role of IC Package Design Engineer. If you have a passion for advanced package and PCB design, we invite you to attend our walk-in drive!
Interview Details
- Date: 16 May 2026 (Saturday)
- Time: 9:00 AM – 2:00 PM
- Venue: Tower 4, GF café 3 , HCLTech, Jigani Campus, Bangalore
- Mode: Face-to-Face (F2F)
- SPOC: Mareeswari C M
Role: IC Package Design Engineer
Experience: 3+ Years
Key Responsibilities & Required Skills
- Strong experience in IC Package / Substrate Design (mandatory)
- Hands-on experience with Cadence APD (Allegro Package Designer)
- Good understanding of package/substrate design and assembly rules, especially for flip chip designs
- Exposure to various package technologies such as MCM, Flip-Chip, Wire Bond, 2.5D, 3D (added ...
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