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NPI Engineer (FOL & Back-end)

📍 Onsemi • Vietnam, Dong Nai, Vietnam • Posted June 10, 2026

Full time Posted June 10, 2026
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Job Description

Job Summary: 

· Power module assembly process (End of Line: Mold, Trim/Form, CD/ED) Development. 


· Key person responsible to align processes between R&D and Manufacturing. 


· Establish process POR through set up, feasibility and characterization followed by package development procedure. 

Responsibilities

  • Involve in tooling design, new material exploration, new generation die technology characterization and new technology of assembly for semiconductor industry
  • Troubleshooting the issue during development stage with analytical and technical skill
  • Exploring new technology in the market and competitor movement.
  • Develop process flow for new package development in semiconductor

    • Qualifications & experience

  • Degree in Mechanical, Mechatronics Engineering, Electronic, Materials or relevant educational background. 
  • Minimum 5 years’ experienced in Semiconductor area

    • KNO...

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