Package Design Engineer

**Job Description**:
Additional responsibilities:
- IC top level floor planning including hard macro block placement, padring, RDL and bump pattern/assignment
- System level co-design methodology of IC, Package and PCB/Boar
- Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost
- Package design flow methodology implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specs
- Package design flow methodology implementing power distribution network (PDN) constraints for high speed processor cores (1GHz+) including design optimization techniques at the die/pkg/PCB levels
- Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products
Minimum Qualifications:
- Bachelor's degree in Engineering, Information Systems, Computer Science, or related f...