Package Silicon Technology Node Development Director/DMTS

Director / DMTS - Package Development Engineering (PDE)

Micron Technology is seeking an accomplished technical leader to join our Package Development Engineering (PDE) organization as a Director / Distinguished Member of Technical Staff (DMTS). In this role, you will define and drive chip-package interaction (CPI) technology strategy and roadmaps to enable advanced silicon node transitions in next‑generation memory products. You will operate at the intersection of silicon, package, and system‑level integration, ensuring robust technology readiness and risk mitigation across increasingly complex design and process landscapes. This is a high‑impact, cross‑functional leadership role, requiring close collaboration with global engineering teams spanning Fab Process Integration, Product Development, Package Design, Assembly Technology Development, and Global Quality. You will play a critical role in shaping future memory product success through technology innovation, risk mana...