Job Description
General Summary
Join this team focused on RF Front End Modules for the Cellular and Wireless Data markets. You will be part of the Business Unit Engineering organization, working closely with Design, Test, NPI Planning, Program Management, Product Marketing, Quality, Reliability, Operations, Customer Engineering, Supplier Quality, and internal and external manufacturing partners. This position requires a senior technical specialist who owns end‑to‑end packaging technology and product integration, including wafer pre‑assembly (wafer BE), spanning technology development, chip‑to‑package co‑design, NPI, high volume manufacturing (HVM) interaction, and customer lifecycle support, to deliver robust and scalable solutions. Responsibilities
Operate as a senior technical lead in a global, cross‑functional matrix, driving technology readiness, execution, and product timelines. Drive development and integration of Si and GaAs packaging processes from wafer‑level interconnect and RDL throug...
Join this team focused on RF Front End Modules for the Cellular and Wireless Data markets. You will be part of the Business Unit Engineering organization, working closely with Design, Test, NPI Planning, Program Management, Product Marketing, Quality, Reliability, Operations, Customer Engineering, Supplier Quality, and internal and external manufacturing partners. This position requires a senior technical specialist who owns end‑to‑end packaging technology and product integration, including wafer pre‑assembly (wafer BE), spanning technology development, chip‑to‑package co‑design, NPI, high volume manufacturing (HVM) interaction, and customer lifecycle support, to deliver robust and scalable solutions. Responsibilities
Operate as a senior technical lead in a global, cross‑functional matrix, driving technology readiness, execution, and product timelines. Drive development and integration of Si and GaAs packaging processes from wafer‑level interconnect and RDL throug...
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