Job Description
Job Description
Qualifications
Within the project, your main tasks will include:
- Placing electronic components (ICs, resistors, capacitors, connectors, etc.)
- Routing signal, power, and ground traces
- Managing multilayer stack-ups
- Ensuring signal integrity, EMC/EMI, thermal performance, and reliability
- Applying design rules and manufacturing constraints (DFM, DFA, DFT)
- Preparing manufacturing files (Gerbers, ODB++, pick-and-place, BOM)
Qualifications
With a Master’s degree (BAC+5) from an engineering school or university specializing in embedded systems, you have a 1st successful experience in the field of electronics, HW engineer or physical layout of PCBs.
- Strong understanding of electronics and schematics
- Knowledge of PCB manufacturing processes
- IPC standards knowledge (IPC‑2221, IPC‑7351, IPC‑A‑610 is a plus)
- Signal integrity and power integrity basics
- Attention to deta...
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