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R&D Engineer: Test Engineering Wafer Test, Final Module Test & Characterization

📍 Broadcom Inc. • Regensburg, Bavaria, Germany • Posted June 20, 2026

Full time Posted June 20, 2026
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Job Description

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Job Description:

Development of device testing at wafer level, die level and module level


More specific duties include the following:

  • Definition of test requirements and test methods for our optoelectronic transceiver and sensor products as well as for our in-house mixed signal ASICs and sensor chips, which are used within these products.
  • Development, bring up and debugging test hardware and software for evaluation, device characterization (bench) and production testing. This can be either completely in-house or in cooperation with external engineering partners.
  • Design of test application PCBs, test sockets, probe cards.
  • Handover of test s...

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