Job Description
A technology company in Singapore is seeking a middle to senior level packaging design and signal/power integrity Engineer. The role involves designing micro-electronic packages, collaborating with a multi-disciplinary team, and optimizing performance through simulation. Candidates should possess a Bachelor’s degree and 5 years of experience, with strong skills in substrate design and EDA tools like Siwave and HFSS. The position offers competitive salary, comprehensive benefits, and opportunities to work with cutting-edge technologies.
#J-18808-Ljbffr
#J-18808-Ljbffr
Apply for This Position
Ready to take the next step? Click the button below to submit your application.
Submit Application