Senior Research Engineer, Bonding Eng Ops (FAB), IME

Advanced Packaging Bonding Engineer supports translational semiconductor research by bridging advanced packaging innovations with industry‑relevant manufacturing practices. The role focuses on operational engineering control of bonding processes—including wafer‑to‑wafer, die‑to‑wafer, and hybrid bonding—within a research fab or pilot line environment.

The engineer ensures process robustness, alignment accuracy, yield performance, and scalability for transfer to industrial partners, while maintaining operational discipline comparable to leading semiconductor packaging and assembly fabs.

This position plays a critical role in enabling heterogeneous integration, 3D integration, chiplet architectures, and advanced packaging schemes through joint development programs (JDPs) and technology transfer initiatives.

• Own day‑to‑day operational engineering control of advanced bonding processes (e.g., thermo‑compression, h...