Job Description
Responsibilities
- Engage semiconductor customers to understand packaging roadmap, process requirements, throughput targets, yield and reliability challenges.
- Support technical sales activities and customer discussions.
- Benchmark competitor equipment and identify technology gaps.
- Translate customer requirements into internal equipment specifications.
- Develop and optimize TCB process parameters on TCB Equipments.
- Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration.
- Troubleshoot bonding issues such as non-wet, misalignment, voids, delamination and warpage.
- Conduct DOE and process characterization activities.
- Work closely with Mechanical, Software, Electrical, Motion and Vision teams.
- Define alignment accuracy, thermal performance, bond force profiles, throughput targets and process windows.
- Lead machi...
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