Job Description
UNITED TEST AND ASSEMBLY CENTER LTD in Singapore is seeking an experienced engineer to focus on process yield engineering and bump process integration. The role involves collaborating with cross-functional teams to troubleshoot process-related issues and executing continuous improvement projects.
The ideal candidate will have a degree in Engineering with at least 3 years of relevant experience in the semiconductor industry, familiarity with SPC and APQP, and strong analytical skills.
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