Job Description
**Our vision is to transform how the world uses information to enrich life for** **_all_** **.**
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Responsible for CPI related issues for Micron’s DRAM memory products from pathfinding through NPI start up into HVM. Establish package program plans for new DRAM fab technology process nodes specific to DRAM 3DS products, coordinate DRAM device/package/module end-to-end reviews. Fundamental understanding of key risks in Fab BEOL (Backend of Line), Fab memory array design/processes, wafer probe flows, wafer/device bumping & flip chip assembly technologies, package design, assembly processes, and materials & process interaction effects.
Employer will accept a Master’s degree in Material Science Engineering, Chemical Engineering, Metallurgical Engi...
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Responsible for CPI related issues for Micron’s DRAM memory products from pathfinding through NPI start up into HVM. Establish package program plans for new DRAM fab technology process nodes specific to DRAM 3DS products, coordinate DRAM device/package/module end-to-end reviews. Fundamental understanding of key risks in Fab BEOL (Backend of Line), Fab memory array design/processes, wafer probe flows, wafer/device bumping & flip chip assembly technologies, package design, assembly processes, and materials & process interaction effects.
Employer will accept a Master’s degree in Material Science Engineering, Chemical Engineering, Metallurgical Engi...
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